DBC substrate (Direct Bonded Copper)
Ion migration risk is reduced! Insulation substrate for power modules.
The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.
- Company：HNS
- Price：Other
